中文(中国)
- English
- 中文(中国)
- Русский
- 한국어
- עִבְרִית
中文(中国)
Xpedition Package Integrator-Package Integrator users can drive rule-based I/O-level optimization and perform pin and ball-out studies from their respective domains, visualizing the impact across the complete system, and generating an automated central data library in the process.
PRODUCT FEATURES:
Visualize and optimize complex IC/package/board systems in a seamless co-design environment.
Advanced tools for package model extraction, and analysis of SI/PI/thermal conditions and manufacturability.
Enable the use of a single tool for development of PCB, MCM, SiP, RF, hybrid, and BGA designs.
Accelerate design and maximize team productivity with concurrent design and efficient project reviews.
Optimize design for manufacturability, and accelerate NPI hand-off.
Integrated Xpedition and Calibre® environment supports InFO requirements and provides quicker design completion
电话 Call：131 2087 8846
邮箱 Email：
地址 Add：上海市嘉定区环城路2222号1幢
